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Publications

Selected Journal Publications
 

  • 2019
    1. Lee, J., Kwon, D.*, Pecht, M., (2019) “Reduction of Li-ion Battery Qualification Time Based on Prognostics and Health Management,” IEEE Transactions on Industrial Electronics, vol. 66(9), pp. 7310-7315. (IF: 7.050, 1.64%) [Link]
    2. Park, E., Kim, N., Kim, S., Kwon, D.*, (2019) “Non-Destructive Wire Fault Diagnosis Using Resistance Spectroscopy Analysis,” Journal of Mechanical Science and Technology, vol. 33(8), pp. 3649-3654. (IF: 1.194, 66.41%) [Link]
    3. Kim, G., Kwon, D.*, (2019) “Warpage Simulation during Fan-Out Wafer Level Packaging Process,” Nanoscience and Nanotechnology Letters, in press (IF: 2.917, 26.03%)
    4. Saxena, S.*, Kwon, D., Pecht, M., and Xing, Y., (2019) “Accelerated Degradation Model for C-rate Loading of Lithium-ion Batteries,” International Journal of Electrical Power and Energy Systems, vol. 107, pp. 438-445. (IF: 3.610, 17.12%) [Link]
    5. Oh, Y., Ransikarbum, K., Busogi, M., Kwon, D., and Kim, N.*, (2019) “Adaptive SVM-based Real-time Quality Assessment for Primer-Sealer Dispensing Process of Sunroof Assembly Line,” Reliability Engineering and System Safety, vol. 184, pp. 202-212. (IF: 4.139, 7.23%) [Link]
    6. Lee, J., Kwon, D.*, Kim, N., and Lee, C., (2019) “PHM-based Wiring System Damage Estimation for Near Zero Downtime in Manufacturing Facilities,” Reliability Engineering and System Safety, vol. 184, pp. 213-218. (IF: 4.139, 7.23%) [Link]
    7. Kim, G., Kang, G., and Kwon, D.*, (2019) “Effect of Material Property Uncertainty on Warpage during Fan Out Wafer-Level Packaging Process,” Journal of Microelectronics and Packaging Society, vol. 26(1), pp. 29-33. [Link]
  • 2018
    1. Shin, I., Koo, K., Kwon, D.*, (2018) “Development of a Non-invasive On-chip Interconnect Health Sensing Method Based on Bit Error Rates,” Sensors, vol. 18(10), pp. 1-13. (IF: 2.475, 26.23%) [Link]
    2. Ha, S., Ransikarbum, K., Han, H., Kwon, D., Kim, H., and Kim, N.*, (2018) “A Dimensional Compensation Algorithm for Vertical Bending Deformation of 3D printed Parts in Selective Laser Sintering,” Rapid Prototyping Journal, in press. (IF: 2.346, 27.34%) [Link]
    3. Shin, I., Lee, J., Lee, J., Jung, K., Kwon, D.*, Youn, B., Jang, H., Choi, J., (2018) “A Framework for Prognostics and Health Management Applications toward Smart Manufacturing Systems,” International Journal of Precision Engineering and Manufacturing – Green Technology, vol. 5(4), pp. 547-566. (IF: 3.774, 8.59%) [Link]
    4. Lee, C., Kwon, D.*, (2018) “A Similarity Based Prognostics Approach for Real Time Health Management of Electronics using Impedance Analysis and SVM Regression,” Microelectronics Reliability, vol. 83, pp. 77-83. (IF: 1.236, 70.38%) [Link]
    5. Baek, S., Kwon, D.*, and Kim, D.*, (2018) “Early Degradation Detection of the Insulation Resistance of MLCCs by the Pattern Analysis of Capacitance and Dissipation Signals,” Nanoscience and Nanotechnology Letters, vol. 10. pp.1-5. (IF: 2.917, 26.03%) [Link]
    6. Shin, I., and Kwon, D.*, (2018) “Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian tracking approaches,” Smart Structures and Systems, vol. 22(2), pp. 167-174. (IF: 2.231, 25.00%) [Link]
    7. Kim, G., and Kwon, D.*, (2018) “Warpage Analysis during Fan-Out Wafer Level Packaging Process using Finite Element Analysis,” Journal of Microelectronics and Packaging Society, vol. 25(1), pp. 41-45. [Link]
    8. Baek, S., Baek, W., Kwon, D., and Kim, D.*, (2018) “Defect State and Severity Analysis Using the Discretized State Vectors,” Journal of Mechanical Science and Technology, vol. 32(6), pp. 2441-2451. (IF: 1.194, 66.41%) [Link]
    9. Lee, C.*, Kwon, O., Kim, M., and Kwon, D., (2018) “Early Identification of Emerging Technologies: A Machine Learning Approach Using Multiple Patent Indicators,” Technological Forecasting and Social Change, vol. 128, pp. 291-303. (IF: 3.129, 12.28%) [Link]
  • 2017
    1. Kwon, D., Park, E., Ha, S., and Kim, N.* (2017) “Effect of Humidity Changes on Dimensional Stability of 3D Printed Parts,” International Journal of Precision Engineering and Manufacturing, vol. 18(9), pp. 1275-1280. (IF: 1.661, 52.34%) [Link]
    2. Shin, I., and Kwon, D.* (2017) “Reliability Assessment of Low-Power Processor Packages in Supercomputing Systems,” Nanoscience and Nanotechnology Letters, vol. 9(8), pp. 1241-1245. (IF: 2.917, 26.03%) [Link]
    3. Su, S.*, Rudas, I., Zurada, J., Er, M., Chou, J., and Kwon, D., (2017) “Industry 4.0: A Special Section in IEEE Access,” IEEE Access, vol. 5, pp. 12257-12261. (IF: 3.557, 16.22%) [Link]
    4. Park, E., Kwon, D.*, Sa, Y., (2017) “Reliability Assessment and Prediction of Solder Joints in High Temperature Heaters,” Journal of Microelectronics and Packaging Society, vol. 24(2), pp. 23-27. [Link]
    5. Lee, J., and Kwon, D.* (2017) “A Digital Technique for Diagnosing Interconnect Degradation by Using Digital Signal Characteristics,” Microelectronics Journal, vol. 60, pp. 87-93. (IF: 1.322, 67.31%) [Link]
  • 2016
    1. Kwon, D.*, Hodkiewicz, M., Fan, J., Shibutani, T., and Pecht, M. (2016) “IoT-Based Prognostics and Systems Health Management for Industrial Applications,” IEEE Access, vol. 4, pp. 3659-3670. (IF: 3.557, 16.22%) [Link]
    2. Kwon, D.* and Yoon, J. (2016) “A Model-based Prognostic Approach to Predict Remaining Useful Life of Interconnects using Impedance Analysis,” Journal of Mechanical Science and Technology, vol. 30(10), pp. 4447-4452. (IF: 1.194, 66.41%) [Link]
    3. Park, J., and Kwon, D.* (2016) “Detection of MLCC Failure Precursors based on Symbolic Time Series Analysis,” Nanoscience and Nanotechnology Letters, vol. 8(1), pp. 75-80. (IF: 2.917, 26.03%) [Link]
    4. Park, J., and Kwon, D.* (2016) “Reliability Assessment of Low-Power Processor Packages for Supercomputers,” Journal of Microelectronics and Packaging Society, vol. 23(2), pp. 37-42. [Link]
  • 2015 and earlier
    1. Kwon, D.*, Azarian, M. H., and Pecht, M. (2015) “Remaining Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5(11), pp. 1602-1609. (IF: 1.660, 54.62%) [Link]
    2. Kwon, D.*, and Shin, I. (2015) “Optimal Interval Censoring Design for Reliability Prediction of Electronic Packages,” Journal of Microelectronics and Packaging Society, vol. 22(2), pp. 1-4. [Link]
    3. Kwon, D.*, Azarian, M. H., and Pecht, M. (2013) “Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear Modeling,” Journal of Microelectronics and Packaging Society, vol. 20(3), pp. 1-4. [Link]
    4. Kwon, D., Azarian, M. H.*, and Pecht, M. (2011) “Non-Destructive Sensing of Interconnect Failure Mechanisms using Time Domain Reflectometry,” IEEE Sensors Journal, vol. 11(5), pp. 1236-1241. (IF: 2.617, 22.95%) [Link]
    5. Kwon, D., Azarian, M. H.*, and Pecht, M. (2010) “Prognostics of Interconnect Degradation using RF Impedance Monitoring and Sequential Probability Ratio Test,” International Journal of Perfomability Engineering, vol. 6(5), pp. 443-452. [Link]
    6. Kwon, D., Azarian, M. H.*, and Pecht, M. (2009) “Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance,” IEEE Trans. on Device and Materials Reliability, vol. 9(2), pp. 296-304. (IF: 1.512, 60.00%) [Link]


     
    Selected Conference Proceedings

    1. Lee, J., and Kwon, D.* (2017) “Real-time Diagnosis of Wire Degradation based on Digital Signal Analysis,” IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL. [Link]
    2. Park, J., Ha, S., Park, E., Kwon, D.*, and Kim, N. (2016) “Hygroscopic Swelling Behavior of 3D Printed Parts due to Changes in Environmental Conditions,” ASME International Design Engineering Technical Conference, Charlotte, NC. [Link]
    3. Lee, J., Kwon, D.* (2016) “An Approach to Monitor Interconnect Degradation for Prognostics of Electronics Based on Digital Signal Characterization,” International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Jiuzhaigou, China.
    4. Shin, I., Park, J., and Kwon, D.* (2016) “Service Life Estimation of Supercomputing Systems based on Low-power Processors,” International Conference on Future Information & Communication Engineering, Da Nang, Vietnam. [Link]
    5. Lee, J., and Kwon, D.* (2016) “Use of Digital Signal Characteristics for Solder Joint Failure Precursors,” IEEE Electronic Components and Technology Conference, Las Vegas, NV. [Link]
    6. Ha, S., Han, H., Kwon, D., Kim, N.*, Kim, H., Hwang, C., Shin, H., and Park, K. (2015) “Systematic Dimensional Calibration Process for 3D Printed Parts in Selective Laser Sintering,” ASME International Design Engineering Technical Conference, Boston, MA. [Link]
    7. Yoon, J., Shin, I., Park, J. and Kwon, D.* (2015) “A Prognostic Method of Assessing Solder Joint Reliability Based on Digital Signal Characterization,” IEEE Electronic Components and Technology Conference, San Diego, CA. [Link]
    8. Yoon, J., Park, M., Yang, H., Kwon, D.*, and Song, M. (2014) “Statistical Forecasting of Material Demand through Big Data Analysis,” Asia Pacific Industrial Engineering and Management Systems Conference, Jeju, South Korea.
    9. Pei, M.*, Han, R., Kwon, D., Lucero, A., Vasudevan, V., Kwasnick, R., and Polasam, P. (2013) “Define Electrical Packaging Temperature Cycling Requirement with Field Measured User Behavior Data,” IEEE Electronic Components and Technology Conference, Las Vegas, NV. [Link]
    10. Han, R.*, Pei, M., Kwon, D., Ge, Y., Harries, R., Bhatti, P., and Zheng, T. (2013) “A Preliminary Solder Joint Life Prediction Model by Experiment and Simulation for Translation of Use Condition to Temperature Cycling Test Condition,” IEEE Electronic Components and Technology Conference, Las Vegas, NV. [Link]
    11. Rangaraj, S.*, Kwon, D., Pei, M., Lucero, A., Hicks, J., Leatherman, G., Wilson, T., Streit, S., and He, J. (2013) “Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mechanical Failure Modes Resulting from Moisture Exposure under Use Conditions,” IEEE International Reliability Physics Symposium, Monterey, CA. [Link]
    12. Kwon, D.* and Lucero, A. (2012) “Optimized Reliability Test Design to Reduce Uncertainties in Reliability Assessment,” IEEE Electronic Components and Technology Conference, San Diego, CA. [Link]
    13. Kwon, D., Azarian, M. H.*, and Pecht, M. (2010) “Degradation of Digital Signal Characteristics due to Intermediate Stages of Interconnect Failure,” IEEE Workshop on Signal Propagation on Interconnect, Hildesheim, Germany. [Link]
    14. Kwon, D., Azarian, M. H.*, and Pecht, M., (2010) “Comparative Analysis of Interconnect Degradation using RF Impedance and Event Detectors,” IPC APEX Expo, Las Vegas, NV.
    15. Azarian, M. H.*, Kwon, D., and Pecht, M. (2009) “Use of Skin Effect for Detection of Interconnect Degradation,” International Microelectronics and Packaging Society, San Jose, CA. [Link]
    16. Kwon, D., Azarian, M. H.*, and Pecht, M. (2009) “Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies Using RF Impedance Analysis,” IEEE Electronic Components and Technology Conference, San Diego, CA. [Link]
    17. Kwon, D., Azarian, M. H*., and Pecht, M. (2009) “Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis,” IEEE Workshop on Signal Propagation on Interconnect, Strasbourg, France. [Link]
    18. Kwon, D., Azarian, M. H*., and Pecht, M. (2008) “Early Detection of Interconnect Degradation Using RF Impedance and SPRT,” IEEE Prognostics and Health Management Conference, Denver, CO. [Link]
    19. Kwon, D., Azarian, M. H.*, and Pecht, M. (2008) “Detection of Solder Joint Degradation Using RF Impedance Analysis,” IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL. [Link]
    20. Kwon, D., Azarian, M. H.*, and Pecht, M. (2008) “Effect of Solder Joint Degradation on RF Impedance,” IEEE Workshop on Signal Propagation on Interconnect, Avignon, France. [Link]